Staff Engineer Equipment Engineering
Core
Drive Die Bond and SMT planned maintenance systems, execute equipment improvements, and lead maintenance teams to ensure machine performance, reliability, and cost optimization in semiconductor production.
Role type
Staff Engineer, Equipment Engineering (Manufacturing/Maintenance)
Builds
High-availability equipment platforms and optimized maintenance frameworks for semiconductor manufacturing
Domain
Semiconductor manufacturing / Power systems
Required skills
Mechanical engineering, Manufacturing processes, Equipment qualification, Team leadership, Root cause analysis, Cost management, Process governance, SMT/Die Bond knowledge, Equipment upgrade, Competence development
Preferred skills
SMT equipment familiarity, Die Bond process knowledge
Technologies
OneSAP PM, NICA, MPFMEA, BE MNT methodology
Responsibilities
Drive Die Bond/SMT planned maintenance methodology, Execute equipment improvement and governance, Lead maintenance teams and define parts life span, Manage maintenance costs, Develop EQ governance business process, Execute planned maintenance per BE MNT methodology, Review maintenance scheduling via alarm analysis, Qualify new equipment and develop technician competence, Collaborate on maintenance cost optimization projects
Seniority
Staff, hands-on IC with team leadership