Senior Wirebond Equipment Engineer
Core
Evaluate, select, and order wirebond equipment; oversee installation, modification, upgrade, and maintenance of manufacturing equipment to ensure uptime and reliability.
Role type
Senior IC equipment engineer (wirebond)
Builds
Semiconductor manufacturing equipment and processes
Domain
Semiconductor manufacturing / Hardware engineering
Deliverable
infrastructure
Required skills
Wirebond equipment maintenance (KNS, ASM), Gold/Cu/PCC wire bonding, Bump ball process, Plasma equipment, Die coat equipment, Tool monitoring software, Preventative maintenance scheduling, Semiconductor cleanroom protocols, SPC/Spotfire techniques
Preferred skills
Wirebond process experience, Hands-on KNS/ASM machine operation, Post-wirebond equipment experience, Tool monitoring and interdiction software, Semiconductor manufacturing knowledge
Technologies
KNS, ASM, Spotfire, Plasma, Die coat
Responsibilities
Evaluate and select cost-effective manufacturing equipment, Oversee equipment installation and modification, Study equipment performance and reliability, Establish programs to increase uptime, Provide technical support to repair and process engineering, Define preventative maintenance schedules
Seniority
Senior, hands-on IC