SOSM QFN Die Bond and Wire Bond Equipment Engineer
Core
Sustaining, maintaining, and improving Die Bond and Wire Bond equipment to ensure high uptime and manufacturing efficiency in semiconductor assembly operations.
Role type
Senior IC equipment engineer (semiconductor assembly)
Builds
Semiconductor assembly equipment reliability and productivity
Domain
Semiconductor manufacturing / Equipment engineering
Deliverable
infrastructure
Required skills
Die Bond and Wire Bond equipment operation, troubleshooting, and maintenance; servo systems and motion control; vision systems and sensors; pneumatics and machine control; preventive and predictive maintenance methodologies; OEE, MTBF, MTTR, FMEA, SPC analysis; equipment qualification and validation; root cause analysis
Preferred skills
Experience with automation and Industry 4.0 initiatives; new product introduction and technology transfer support; machine capability studies
Technologies
Die Bond equipment, Wire Bond equipment, servo systems, motion control, vision systems, sensors, pneumatics
Responsibilities
Lead equipment troubleshooting and root cause analysis for production issues; develop and implement corrective and preventive actions; monitor and analyze equipment performance indicators; lead continuous improvement and cost-reduction projects; support equipment installation, setup, qualification, and release to production; develop and maintain preventive maintenance programs; work with suppliers to resolve technical issues and implement upgrades; drive automation and digitalization initiatives; support new product introduction and technology transfers; perform machine capability studies and equipment validation; develop equipment procedures and spare-parts strategies; ensure compliance with safety, environmental, and quality requirements; support internal and external audits
Seniority
Mid-level, hands-on IC