Senior Staff Specialist Package Technology Development
Core
Lead outsourced package platform qualification, process optimization, and project risk assessment for semiconductor assembly and test (OSAT) to meet time-to-market and quality targets.
Role type
Senior Staff Specialist, Package Technology Development
Builds
Semiconductor package platforms and derivatives for power systems and IoT applications
Domain
Semiconductor manufacturing, OSAT, Package Technology
Required skills
Package development (NPI), Process optimization, Project risk assessment, Bill of Material definition, Design rule application, Subcon management, Technical capability assessment, Quality standards (JEDEC/AEC)
Preferred skills
Module assembly, Wafer level package (WLP), bumping, eWLB, System in Package (SiP), Laminates and lead frame package knowledge
Technologies
OSAT tools, Database systems for specifications
Responsibilities
Lead outsourced package platform qualification and process optimization; Define project complexity and perform risk assessments; Integrate unit processes and create assembly/packing specifications; Apply design rules and verify equipment/process capability; Enable new package platforms and support OSAT development; Drive technical problem-solving in platform task forces.
Seniority
Senior Staff, hands-on IC with strategic oversight
