NPI Senior Process Engineer
Core
Develop, optimize, qualify, and establish robust semiconductor assembly processes for semiconductor packages from wafer preparation to final assembly cleaning to ensure new products meet quality, reliability, productivity, and cost requirements.
Role type
Senior IC process engineer (semiconductor assembly)
Builds
Semiconductor packages (power discrete, power semiconductor)
Domain
Semiconductor manufacturing / Electronics
Required skills
Semiconductor assembly process development, DOE, SPC, process capability analysis, FMEA, root cause analysis, technical reporting, cross-functional collaboration
Preferred skills
Power semiconductor packaging experience, JMP software for DOE, RPA (Power Automate), failure analysis (X-ray, cross-section, SAT), contact angle measurement
Technologies
Plasma cleaning, Wire bonding, AP coating & bake, JMP, Power Automate
Responsibilities
Develop and optimize assembly process conditions for new products; Execute process development plans, engineering & qualification builds, and process validation activities; Establish process parameters, specifications, control limits, and acceptance criteria; Evaluate process feasibility, identify manufacturing risks, and implement preventive actions; Prepare technical reports, process documentation, and qualification summaries; Collaborate with Production, Equipment Eng, QA, Product Eng, and Material Eng; Prepare and maintain process specifications, SOPs, work instructions, and risk assessments; Support PFMEA reviews and implementation of process controls.
Seniority
Senior, hands-on IC
