NPI Senior Process Engineer
Core
Develop, optimize, qualify, and establish robust semiconductor assembly processes for semiconductor packages from wafer preparation to final assembly cleaning to ensure new products meet quality, reliability, productivity, and cost requirements.
Role type
Senior IC NPI Process Engineer (Semiconductor Assembly)
Builds
Semiconductor packages (power discrete, power semiconductor, MOSFET) for Automotive, Industrial, Infrastructure, and IoT markets
Domain
Semiconductor manufacturing / Power electronics
Required skills
Semiconductor assembly process development, DOE, SPC, process capability analysis, FMEA, root cause analysis, technical reporting, cross-functional collaboration
Preferred skills
Power semiconductor packaging experience, Taiko wafer handling, solder joint inspection, void analysis, X-ray inspection, cross-section analysis, package failure analysis, mass production ramp-up
Technologies
Wafer mounting, wafer dicing, solder printing, die bonding, clip bonding, vacuum reflow, flux cleaning
Responsibilities
Develop and optimize assembly process conditions for new products; Prepare and execute process development plans, engineering & qualification builds, and process validation activities; Establish process parameters, specifications, control limits, and acceptance criteria; Evaluate process feasibility, identify potential manufacturing risks, and implement preventive actions; Collaborate with Production, Equipment Eng, QA, Product Eng, Material Eng, and other relevant departments; Prepare and maintain process specifications, SOPs, work instructions, process flow documents, and risk assessments
Seniority
Senior, hands-on IC
