Staff / Senior Staff Engineer Package Technology Development
Core
Lead outsourced package platform qualification, process optimization at subcontractors, and define package specifications for semiconductor assembly and test.
Role type
Senior Staff Engineer, Package Technology Development
Builds
Semiconductor packages (Module, WLP, SiP) and assembly/test processes for power systems and IoT
Domain
Semiconductor manufacturing, OSAT (Outsourced Semiconductor Assembly and Test)
Required skills
Package development (NPI), Subcontractor management, Process optimization, Risk assessment, Design rule application, Bill of Material definition, Technical problem solving
Preferred skills
Module assembly, Wafer level package (WLP), bumping, eWLB, System in Package (SiP), Laminates and leadframe package knowledge, JEDEC/AEC grade quality requirements
Technologies
OSAT processes, Assembly and test equipment, Database systems for specifications
Responsibilities
Lead outsourced package platform qualification and process optimization at subcons; Define project complexity and perform risk assessments; Integrate unit processes and create assembly/packing specifications; Apply and verify design rules based on baseline documents; Define process and select Bill of Material for development; Enable new package platforms at OSATs; Drive technical problem solving for platform tasks
Seniority
Senior Staff, hands-on IC with strategic oversight