CDI - Flip-Chip Process Development Engineer - Advanced Packaging & Photonics F/H
Core
Develop, qualify, and industrialize Flip-Chip processes for STMicroelectronics' Advanced Packaging – Photonics products to ensure quality, performance, and competitiveness.
Role type
Process Development Engineer (Advanced Packaging)
Builds
Flip-Chip processes, advanced packaging technologies (fine pitch, thermocompression, hybrid bonding), and prototypes for Photonics products.
Domain
Semiconductor manufacturing, Advanced Packaging, Photonics
Required skills
DOE and statistical analysis, FMEA/risk management, failure analysis, process optimization, equipment evaluation, cross-functional collaboration
Preferred skills
Experience in process development or industrialization, knowledge of Flip-Chip Packaging and Photonics, technical leadership, autonomy
Technologies
JMP, 8D methodology
Responsibilities
Define and execute design of experiments (DOE), support pilot line prototype manufacturing, drive process validation through reliability standards, perform risk analyses, support failure analyses and define corrective actions, ensure technology transfer and production ramp-up at Back-End sites
Seniority
Mid-Senior, hands-on IC