Process Development Engineer - mold + grinding/laser mark/ball attach/package saw
Core
Develop, set up, and industrialize PLP Ball Attach and Package Saw processes for semiconductor assembly manufacturing.
Role type
Process Development Engineer (Semiconductor Assembly)
Builds
PLP Ball Attach and Package Saw processes for new products and materials
Domain
Semiconductor manufacturing / Assembly
Required skills
Statistical data analysis, 8D problem solving, DMAIC, Process Mapping, Fishbone analysis, 5 Whys, Manufacturing operations knowledge
Preferred skills
Cross-functional collaboration, Continuous improvement, Troubleshooting
Technologies
PLP Ball Attach, Package Saw, FMEAs, SOPs, Process control plans
Responsibilities
Develop and industrialize PLP Ball Attach and Package Saw processes, Support introduction of new products and materials, Characterize processes and materials, Prepare and update process specifications and documentation, Conduct process optimization for quality and yield, Provide technical support for process issues, Collaborate with cross-functional teams
Seniority
Mid-level, hands-on IC