NPI Leadframe / Die Attach Manager
Core
Leading NPI, process development, and material qualification for leadframe, substrate, and die attach technologies to ensure robust process transfer and manufacturing stability.
Role type
Senior IC NPI Leadframe/Die Attach Process Manager
Builds
Semiconductor assembly processes and materials for new product introduction and production scale-up
Domain
Semiconductor manufacturing / Materials Engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Leadframe/substrate/die attach process development, material qualification, process transfer, DOE, SPC, failure analysis, root cause analysis, vendor assessment, PFAS-free material compliance, project management, cross-functional alignment
Preferred skills
Experience with PFAS-free materials, advanced statistical tools (JMP)
Technologies
JMP, SPC, DOE tools, die attach equipment
Responsibilities
Lead NPI process teams for leadframe/substrate/die attach; Define and challenge assembly design rules and process windows; Drive process development and validation for new materials/equipment; Assess die attach equipment vendors and tool performance; Manage engineering changes and qualification plans; Perform technical risk assessments and failure analysis; Optimize assembly processes for yield and reliability; Ensure compliance with environmental and customer requirements.
Seniority
Senior, hands-on IC
