Principal Hardware Systems Technical Lead
Core
Provide technical leadership to build next-generation silicon photonics-based AI accelerators and interconnect products for extreme-scale data centers.
Role type
Principal Hardware Systems Technical Lead (IC)
Builds
Board and system solutions for photonic AI infrastructure and massive scale-out interconnect platforms
Domain
AI/HPC data center infrastructure, silicon photonics, high-speed digital interfaces
Deliverable
production ML models | product features
Required skills
Hardware systems development lifecycle ownership, PCB design, high-speed SerDes, PCIe/Ethernet/SPI/I2C/JTAG protocols, VRM design, cross-functional integration (electrical/mechanical/firmware), technical mentorship, systems engineering methodology
Preferred skills
AI/HPC data center hardware design, optical transceivers, silicon photonics products, advanced packaging technologies, high-density PCB design
Technologies
PCIe, Ethernet, SPI/QSPI, I3C, I2C, JTAG, SerDes, VRMs
Responsibilities
Lead hands-on integration, verification, and validation across bench bring-up, EVT/DVT, and production release; Define, develop, and review PCBAs to meet system-level electrical, power, and interface requirements; Collaborate with system architects to define hardware systems for photonic AI infrastructure applications; Mentor and provide technical guidance to engineers on the team; Research components and technologies to meet current and next-generation product goals
Seniority
Principal, hands-on IC with strategic oversight
