Director - Hardware Engineering, AI Infrastructure Systems
Core
Establish and run the AI Infrastructure Systems division to deliver next-generation accelerator silicon (PCIe/CXL cards, OAM modules, rack systems) for enterprise AI, sovereign cloud, and HPC customers.
Role type
Director, Hardware Engineering (AI Infrastructure Systems)
Builds
PCIe Gen6/CXL accelerator cards, OAM modules, UBB baseboards, 1U/2U rack systems, and dense compute nodes.
Domain
Datacenter hardware, AI infrastructure, high-speed interconnects, thermal/mechanical design.
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Hardware architecture, PCB design, power/thermal/mechanical engineering, firmware stack design, high-speed signaling (PCIe/CXL/SerDes), NPI/ramp management, vendor management (CMs/ODMs), budget ownership, strategic planning.
Preferred skills
Building/scaling engineering teams, AI accelerator/GPU/custom silicon experience, sovereign AI/EuroHPC/HPC programme exposure.
Technologies
PCIe Gen5/6, CXL, SerDes, BMC, Redfish/IPMI, UEFI/BIOS, OCP standards, 12V/48V/OCP power delivery.
Responsibilities
Build and mentor a multidisciplinary hardware engineering team; define technical roadmap for server products; serve as technical authority for schematics, PCB stack-ups, and high-speed signaling; own end-to-end execution from concept to mass production; drive datacenter-grade platform engineering (firmware, RAS, telemetry); lead thermal/mechanical strategy for high-power platforms; partner with embedded AI and software teams; engage with strategic customers and ecosystem partners; define engineering processes and quality gates.
Seniority
Director, hands-on IC leadership