Intern, Process Engineering (Advanced Packaging)
Core
Develop advanced surface preparation solutions for hybrid bonding interconnect applications to enable high-quality chip communication with minimal power loss.
Role type
Intern, Process Engineering (Advanced Packaging)
Builds
Advanced packaging R&D processes and hybrid bonding solutions for next-generation semiconductor devices
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Process specification definition, Process validation, Experimental design and execution, Data analysis, Equipment operation, Technical communication
Preferred skills
Semiconductor process technology knowledge, Material surface characterization, Data interpretation
Technologies
Hybrid bonding equipment, Metrology tools, Process integration systems
Responsibilities
Define process specifications and requirements for bonding strength and defectivity targets, Perform process validation activities to establish best-known methods, Design and analyze experiments to evaluate process performance, Collaborate with R&D teams on leading-edge technology development, Present findings and recommendations based on experimental data
Seniority
Intern
