AE| Principal Product Application Engineer (Scorpio)
Core
Provide technical guidance to ODMs on designing in semiconductor products, generate product collateral, and drive innovation through feedback to internal teams.
Role type
Principal Product Application Engineer (High-Speed Interconnects)
Builds
Custom connectivity solutions and standards-based portfolio for rack-scale AI infrastructure
Domain
Semiconductor / High-Speed Interconnects / Data Center Infrastructure
Deliverable
product features
Required skills
PCIe LTSSM physical layer expertise, Silicon/System bring-up and debug, Protocol analyzer and oscilloscope operation, Technical writing for application notes, Customer issue resolution leadership
Preferred skills
PCIe 5.0/CXL experience, Switch/Retimer product support, PCIe compliance testing, C-language firmware development, Python scripting, Data Center system architecture knowledge
Technologies
PCIe, CXL, Ethernet, NVLink, UALink, C-language, Python
Responsibilities
Overcome ODM design challenges for complex SoC/silicon products, Generate technical collateral for existing and new products, Provide insightful feedback to improve products and processes, Lead internal teams to resolve technical issues and communicate with customers, Utilize lab equipment for debugging leading-edge semiconductor products, Engage globally with customers including on-site travel
