Principal Product Engineer
Core
Lead and develop next-generation high-speed, high-performance, low-power semiconductor products in advanced process nodes, focusing on post-silicon product development, validation, and test engineering.
Role type
Principal Product Engineer (Semiconductor/High-Speed Connectivity)
Builds
High-speed semiconductor connectivity solutions (XCVRs) for scale-up and scale-out AI infrastructure
Domain
Semiconductor hardware, high-speed digital/analog circuits, test engineering, AI infrastructure
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
High-speed XCVR product development, PCIe Gen3+ protocols, ATE test program development, SerDes protocols (NRZ/PAM4), memory interfaces (DDR5/4), system-level analysis, digital/analog circuit understanding, data analysis (JMP/Spotfire)
Preferred skills
Silicon validation, firmware development (C/C++), Python scripting, product/package qualification
Technologies
Advantest 93k ATE, PCIe, Ethernet, NVLink, CXL, UALink, DDR5/4, JMP, Spotfire
Responsibilities
Update ATE test programs for wafer sort and final test solutions, monitor device ATE test yields and quality, analyze test data to draw conclusions, collaborate with silicon validation teams, ensure device performance meets production requirements
Seniority
Principal, hands-on IC
