Technical Director, Advanced Packaging
Core
Strategic business and technology leader managing SK Hynix's global account for advanced packaging applications within ASM's semiconductor capital equipment suite.
Role type
Senior IC Technical Director (Account Management & Technology Strategy)
Builds
High-performance deposition solutions and advanced packaging services for SK Hynix
Domain
Semiconductor manufacturing / Advanced Packaging / Thin Film Deposition
Deliverable
client delivery
Required skills
Advanced packaging expertise, Thin film deposition systems knowledge, Deposition system experience, Global account management, Strategic partnership building, Cross-functional collaboration, Technical roadmap alignment, Program monitoring, Continuous improvement, Commercial strategy
Preferred skills
SK Hynix Process Development Team experience, MS in Engineering or higher, Ph.D., Advanced packaging development experience
Technologies
Deposition systems, Thin film systems, Diffusion deposition systems
Responsibilities
Manage SK Hynix account globally for technology matters; Build strong technical relationships with customer R&D, Manufacturing, and Purchasing; Align product strengths with customer advanced packaging roadmap; Monitor program progress and adjust strategies; Drive projects across multiple customer sites to secure business; Develop and maintain technical information for stakeholders; Lead service, support, and process engineering teams globally.
Seniority
Senior, hands-on IC with strategic leadership