Technical Director, Advanced Packaging
Core
Strategic business and technology leader managing ASM's global Samsung account, focusing on advanced packaging solutions and building influential customer relationships.
Role type
Senior IC Technical Director (Account Management)
Builds
High-performance semiconductor capital equipment solutions for Samsung Electronics
Domain
Semiconductor manufacturing, Advanced Packaging, Thin film deposition
Deliverable
client delivery
Required skills
Semiconductor capital equipment expertise, Advanced packaging knowledge, Thin film/Diffusion deposition systems, Strategic account management, Cross-functional leadership, Technical roadmap alignment
Preferred skills
Samsung Process Development Team experience, PhD in Engineering, MS in Engineering, Advanced packaging development experience
Technologies
Deposition systems, Thin film systems, Diffusion deposition systems
Responsibilities
Manage Samsung account globally for technology issues and customer service; Build strong technical relationships with customers and stakeholders; Align product strengths with customer advanced packaging roadmap; Monitor program progress and adjust strategies; Drive continuous improvement of customer experience through team and process development; Coordinate cross-functional projects to secure business and build trust.
Seniority
Senior, hands-on IC with strategic leadership