Principal Engineer, HIG-HBM Product System Engineering (Media Health Manufacturing)
Core
Lead Media Health Manufacturing and test flow development for Micron's next-generation High Bandwidth Memory (HBM) products, focusing on DRAM, Interface, and Stacked Die architectures.
Role type
Principal Engineer, HBM Product System Engineering
Builds
Next-generation HBM products (DRAM, Interface, Stacked Die)
Domain
Semiconductor manufacturing, High Bandwidth Memory (HBM)
Required skills
Root cause analysis, circuit debug, test coverage optimization, DFT strategy, yield improvement, project management, cross-functional collaboration, statistics and data analysis, scripting, CAD tools, Verilog simulations
Preferred skills
Product Engineering experience, leadership, AI tools for productivity
Technologies
CAD tools, Verilog, AI tools
Responsibilities
Develop and validate next-generation HBM products; optimize test coverage for current and future designs; improve manufacturing test yields and reduce test time; resolve device and stacked die yield issues; drive DFT strategy innovation; mentor team members; make technical decisions on risk analysis and project prioritization; collaborate with Fab, Design, and Technology Development teams.
Seniority
Principal, hands-on IC with leadership