CareerPlan

HBM EQUIPMENT ENGINEER

Taichung City, Taichung City, TaiwanFull-time2026-11-04 → 2026-11-10

Core

Evaluate and optimize manufacturing processes, lead equipment selection and implementation, and drive qualification and ramp-up of new process equipment for HBM production.

Role type

Manufacturing Equipment Engineer (HBM)

Builds

HBM memory and storage solutions

Domain

Semiconductor manufacturing / High Bandwidth Memory

Required skills

Semiconductor equipment operation and maintenance, Wafer level molding/dicing/thinning/mount/debond, FDC/Tool alarm analysis, Tool installation/setup/buyoff procedures, Root cause analysis, Continuous improvement, Automation and smart monitoring systems

Preferred skills

Tool signal understanding (SVID, CEID, ECID), AI application in job

Technologies

FDC, SVID, CEID, ECID

Responsibilities

Evaluate and optimize manufacturing processes, Lead equipment selection and implementation, Drive qualification and ramp-up of new process equipment, Collaborate with process, quality, procurement, and vendor teams, Lead root cause analysis of equipment issues, Implement automation and smart monitoring systems

Seniority

Mid-level, hands-on IC