Staff Engineer, Product Engineering, Media Health Manufacturing, HIG-HBM
Core
Drive manufacturing test flow development, validation, and yield improvement for next-generation High Bandwidth Memory (HBM) products including DRAM, interface, and stacked die solutions.
Role type
Staff Engineer, Product Engineering (Manufacturing Test & Yield)
Builds
Next-generation HBM products (DRAM, interface, stacked die) for data center and AI applications
Domain
Semiconductor manufacturing / High Bandwidth Memory (HBM)
Required skills
Semiconductor device physics, DRAM architecture, CMOS technology, circuit design, root cause analysis, test flow development, yield improvement, Python scripting, CAD tools, Verilog simulation
Preferred skills
AI-powered tool automation, project management, mentorship, cross-functional collaboration
Technologies
Python, JMP, CAD tools, Verilog
Responsibilities
Develop and validate manufacturing test flows for HBM architectures; Improve device and stack-level yield; Reduce test time and optimize test coverage; Perform deep circuit debug and reliability analysis; Mentor team members and drive technical innovation; Collaborate with Fab, Design, and Technology teams on product enablement.
Seniority
Staff, hands-on IC with mentorship