HBM PYE Product Development Failure Analysis Engineer
Core
Perform electrical, physical, and statistical failure analysis to identify, characterize, and resolve defect and failure mechanisms in next-generation HBM products from design through mass production.
Role type
Product Development Failure Analysis Engineer (HBM)
Builds
Next-generation HBM memory devices
Domain
Semiconductor / Memory Storage
Deliverable
production ML models
Required skills
Electrical failure analysis, Physical failure analysis, Statistical analysis, Root cause analysis, AI-enabled tools, Python programming, Semiconductor device physics, VLSI knowledge, Data analytics
Preferred skills
Generative AI tools, JMP statistical software, Advanced VLSI design, Semiconductor process expertise, Large-scale data analysis
Technologies
Python, JMP, Copilot, Claude, AI/ML tools
Responsibilities
Perform electrical, physical, and statistical failure analysis to identify and characterize defects. Analyze component- and system-level data to resolve root causes using statistical techniques and AI tools. Collaborate with Product, Process, Test, Quality, and Manufacturing teams to resolve fabrication and assembly issues. Identify process defects and test flow marginalities through data analysis. Communicate technical findings and drive corrective actions across multi-functional teams. Support rapid production ramp and product qualification.