Engineer, HIG-HBM Product System & Engineering (Media Health Reliability)
Core
Lead a team to develop and execute reliability test flows for High Bandwidth Memory (HBM) products, driving DPM reduction and root cause analysis for defectivity and intrinsic reliability issues.
Role type
Senior IC reliability engineering manager (semiconductor)
Builds
HBM DRAM and Interface die products for data center, AI, and mobile applications
Domain
Semiconductor manufacturing and reliability engineering
Required skills
Reliability test flow development, Electric Failure Analysis (EFA), Physical Failure Analysis (PFA), Root cause analysis, Process conversion management, Risk management, Cross-functional collaboration, Project management, Technical decision making, Team mentorship
Preferred skills
Semiconductor device experience, Circuit design, Product validation, CMOS technology, DRAM architecture, Device physics, Data analysis, Statistics, Python, JMP
Technologies
Python, JMP, EFA, PFA
Responsibilities
Define reliability stress test flows and plans; Execute qualification plans and manage gating issues; Drive DPM reduction via optimized test strategies; Debug and resolve qual/RMA failures using EFA and PFA; Recommend fab process conversions for yield and cost improvement; Manage risks associated with process conversions; Mentor team members; Make technical decisions on risk and prioritization; Collaborate with Fab, Design, and Quality teams.
Seniority
Senior, hands-on IC with team leadership
