Senior/Staff Engineer, DEMQRA HBM RMA
Core
Oversee failure analysis of customer-returned HBM products, summarize electrical and physical findings, identify root causes, and establish containment plans.
Role type
Senior IC semiconductor reliability engineer (HBM/DRAM)
Builds
Failure analysis reports, root cause identification, and corrective action plans for DRAM/HBM modules
Domain
Semiconductor manufacturing and reliability (DRAM, HBM, Advanced Packaging)
Deliverable
client delivery
Required skills
DRAM operation knowledge, semiconductor device physics, electrical failure analysis (EFA), physical failure analysis (PFA), root cause analysis, cross-functional collaboration, customer communication
Preferred skills
System-level debug experience (CPU/DRAM/OEM), proficiency in AI coding tools (Copilot, Claude Code)
Technologies
ATE, EFA, PFA, DRAM process technologies, advanced packaging, wafer testing, module testing
Responsibilities
Engage customers to clarify failure conditions; oversee bench-level, system-level, and ATE-level analysis; coordinate component-level electrical and physical failure analysis; review feedback from manufacturing and engineering teams; translate technical analysis into customer-friendly conclusions; generate interim and final Failure Analysis (FA) reports; provide containment information and risk assessments
Seniority
Senior, hands-on IC