Senior/Staff Engineer, DEMQRA HBM RMA
Core
Oversee failure analysis of customer-returned High Bandwidth Memory (HBM) products, identify root causes, and establish containment plans.
Role type
Senior IC semiconductor failure analysis engineer
Builds
Failure analysis reports, root cause identification, and corrective action plans for DRAM/HBM modules
Domain
Semiconductor manufacturing and reliability (DRAM/HBM)
Deliverable
client delivery
Required skills
DRAM operation knowledge, semiconductor device physics, electrical failure analysis (EFA), physical failure analysis (PFA), root cause analysis, cross-functional collaboration, customer communication
Preferred skills
System-level debug experience (CPU/DRAM/OEM), proficiency with AI coding tools (Copilot, Claude Code)
Technologies
ATE, EFA, PFA, DRAM process technologies
Responsibilities
Engage customers to clarify failure conditions, oversee bench/system/ATE-level analysis, coordinate component-level electrical and physical failure analysis, summarize findings in customer reports, identify trends and variations, provide risk assessments and containment information
Seniority
Senior, hands-on IC