Process Engineer (Die Attach)
Core
Identify, diagnose, and resolve assembly process problems while optimizing processes, equipment, and materials for new product introductions in semiconductor manufacturing.
Role type
Process Engineer (Die Attach)
Builds
Semiconductor memory and storage products (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing / Electronics
Deliverable
production ML models
Required skills
Statistical analysis, Problem-solving, Process optimization, Supplier management, SPC/FDC/RMS/APC practice, Yield improvement, Cost reduction, Technical presentation
Preferred skills
AI proficiency, AI-enabled ways of working
Technologies
SPC, FDC, RMS, APC
Responsibilities
Identify, diagnose, and resolve assembly process related problems; Coordinate and execute process, equipment, and material evaluation/optimization initiatives; Lead/participate in continuous yield improvement and cost reduction activities; Validate and fan out new process baseline qualified for new product introduction; Practice and support SPC/FDC/RMS/APC; Manage/audit material suppliers to achieve quality, cost, and risk management objectives; Support internal and external audits.
Seniority
Mid-level, hands-on IC