Director, Advanced Packaging Technology Development
Core
Provide strategic and technical leadership for the development and deployment of advanced packaging assembly processes enabling next-generation memory products.
Role type
Director, Advanced Packaging Technology Development
Builds
Scalable, manufacturable, and cost-effective assembly processes for next-generation memory products
Domain
Semiconductor manufacturing / Advanced Packaging
Required skills
Technology strategy and roadmap development, Process technology leadership, Product development and manufacturing readiness, Cross-functional leadership, Organizational leadership, Business impact and execution
Technologies
2.5D, 3DIC, hybrid bonding, wafer-level packaging, panel-level packaging, advanced interconnect solutions, die attach, thermocompression bonding, molding, underfill, substrate assembly, singulation
Responsibilities
Develop and communicate advanced packaging process technology strategies aligned with long-term product and technology roadmap; Define process development roadmaps for next-generation packaging platforms; Lead development of scalable manufacturing solutions for advanced packaging technologies; Represent APTD Process Development in company-wide technical and business initiatives; Build and develop a high-performing technical organization; Ensure critical deliverables, milestones, and business objectives are achieved
Seniority
Director, strategic leadership & team management