Physical Failure Analysis (PFA) Technician
Core
Perform electrical and physical failure analysis on advanced packaging products to identify root causes of defects and failures using advanced failure analysis tools.
Role type
Physical Failure Analysis (PFA) Technician
Builds
Semiconductor memory and storage products (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
SEM/EDX, FIB, X-ray, C-SAM operation, sample preparation, cross-sectioning, decapsulation, polishing, microscopy inspection, semiconductor wafer fabrication knowledge, advanced packaging process knowledge
Preferred skills
Continuous improvement initiatives, AI-enabled enhancements
Technologies
Optical Microscopes, SEM, EDX, FIB, X-ray, C-SAM
Responsibilities
Perform electrical and physical failure analysis on advanced packaging products, Perform sample preparation and laboratory techniques, Operate and maintain analytical equipment, Write and document failure analysis findings and reports, Ensure compliance with laboratory safety and quality management systems, Participate in continuous improvement initiatives
Seniority
Junior to Mid-level, hands-on IC