Package Characterization Lab Manager, APTD
Core
Lead a high-performing team of shift engineers and technicians delivering package characterization and failure analysis (FA) support for leading-edge technology development in advanced packaging.
Role type
Senior IC lab manager (semiconductor failure analysis)
Builds
Package characterization and failure analysis results for advanced packaging technology decisions
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Semiconductor package characterization, Failure analysis, Lab management, Equipment calibration, Vendor coordination, Team leadership, Budgeting, Process optimization, Technical mentorship, Cross-functional collaboration
Preferred skills
Master's/PhD in Materials Science/Physics/Chemistry, Experience with new FA tool models
Technologies
SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X-ray, CSAM, ion milling, delayering, decapsulation
Responsibilities
Lead lab operations to meet KPIs, cycle-time, and safety standards; Plan and optimize FA lab equipment, space, and budget; Coordinate equipment calibration, repairs, and spare parts procurement; Evaluate and introduce new FA tool models; Lead EHS, quality, and customer audits; Provide technical mentorship and drive continuous improvement of methodologies; Collaborate cross-site to benchmark and standardize best-known methods; Ensure FA lab readiness for new product designs; Align task priorities with APTD team members; Deliver actionable package analysis insights; Build and sustain training and development programs; Define and review performance metrics.
Seniority
Senior, hands-on IC with people management