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Process Technician, Advanced Packaging

Boise, Idaho, United States of America💼 Full-time🗓 2026-05-27 → 2026-09-26

Core

Monitoring, maintaining, and improving semiconductor processing equipment performance to support R&D and manufacturing operations in advanced packaging and interconnects.

Role type

Manufacturing Process Technician (Semiconductor)

Builds

Next-generation memory and storage products enabling AI applications

Domain

Semiconductor manufacturing / Advanced Packaging

Required skills

Equipment operation and setup, preventative maintenance, troubleshooting mechanical and software issues, data analysis and reporting, continuous improvement initiatives, safety protocol adherence

Preferred skills

SPC software usage (Minitab, JMP), strategic improvement implementation, STEM education or military training

Technologies

SPC software (Minitab, JMP), semiconductor processing equipment

Responsibilities

Perform technical tests and experiments to support R&D engineering; Set up and operate semiconductor processing equipment; Analyze test run data and prepare reports to assist engineering teams; Identify and resolve chronic inefficiencies through continuous improvement initiatives; Review and prioritize production/development hold lots; Communicate effectively to manage tasks and meet deadlines

Seniority

Entry-level to Mid-level, hands-on IC

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