Technician - F10 Failure Analysis
Core
Perform physical failure analysis on semiconductor wafers using SEM, TEM, and FIB to identify defects and root causes impacting production quality.
Role type
Technician - Semiconductor Failure Analysis
Builds
Production quality assurance for DRAM, NAND, and NOR memory and storage products
Domain
Semiconductor manufacturing / Failure Analysis
Deliverable
physical/clinical work
Required skills
Cross-section analysis, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Focus Ion Beam (FIB), sample de-processing, physical fault isolation, chemical handling, analytical skills
Preferred skills
Real-Time Defect Analysis (RDA) experience, AI tool literacy
Technologies
SEM, TEM, FIB, Failure Analysis tools
Responsibilities
Perform cross-section analysis and SEM inspection; Handle TEM sample preparation using FIB; Identify defects and failure mechanisms; Complete physical fault isolation techniques; Collaborate with engineering teams for tool performance feedback; Support analysis of wafers with functional failures; Preserve documentation of analytical findings.
Seniority
Individual Contributor, shift-based technician