Intern - Engineer, HIG HBM DTPCO
Core
Develop first-principles understanding of HBM cube limitations and validate hypotheses through silicon data and custom bench-level characterization under thermal, mechanical, and electrical stress.
Role type
Senior IC semiconductor characterization engineer (HBM)
Builds
Next-generation High Bandwidth Memory (HBM) solutions
Domain
Semiconductor / Memory / HBM (via careerplan.io/jobs/44751867-intern-engineer-hig-hbm-dtpco-at-micron)
Deliverable
production ML models
Required skills
Semiconductor characterization, failure analysis, root-cause analysis, Python programming, C/C++ programming, Verilog, laboratory equipment operation (oscilloscopes, SMUs, thermal systems), statistical analysis, MBIST analysis
Preferred skills
DRAM/HBM subsystems experience, advanced semiconductor packaging knowledge, DOE methodologies, AI/Agentic AI tool proficiency, parametric characterization
Technologies
Python, Verilog, C/C++, AI tools, Agentic AI, Generative AI
Responsibilities
Design and build custom bench-level test setups, fixtures, and measurement flows; Perform thermal, mechanical, and electrical characterization of HBM cubes; Develop and maintain test programs and stress patterns; Analyze MBIST signatures and complex datasets to identify root causes; Leverage AI tools to improve engineering workflows and data analysis.
Seniority
Senior, hands-on IC
