CareerPlan

Next Gen, High-Speed, Memory and Cache Controller Design Engineer

San Diego, California, United States of AmericaFull-time$101k–$152k2026-10-07 → 2026-11-10

Core

Design and implement high-speed memory and cache controllers (HBM, LPDDR, DDR) for next-generation SoCs, interfacing with CPU, GPU, and DSP.

Role type

Senior ASIC Design Engineer (Memory/Cache Controller)

Builds

High-performance, low-power memory subsystems for Qualcomm mobile and computing products

Domain

Semiconductor / SoC Design / Memory Interfaces

Required skills

RTL coding, memory controller architecture, NoC, timing closure, synthesis, physical design support, gate-level simulation, power analysis, x86/ARM architecture knowledge

Preferred skills

HBM design, SRAM/L3 cache controller design, micro-architecture development

Technologies

RTL, HBM, LPDDR, DDR, NoC, SRAM, L3 cache, x86, ARM

Responsibilities

Develop architecture and design specifications for memory controllers; implement RTL code; debug designs and provide support during integration; contribute to design methodology improvements

Seniority

Senior, hands-on IC