Principal Advanced Node Technology Yield & Diagnostics Engineer
Core
Lead silicon characterization, yield diagnostics, failure analysis, and yield forecasting for next-generation AI platforms on advanced-node logic, HBM, chiplet, and 3DIC technologies.
Role type
Principal Advanced Node Technology Yield & Diagnostics Engineer
Builds
Next-generation AI platforms (logic, HBM, chiplet, 3DIC)
Domain
Semiconductor manufacturing / Advanced node yield engineering
Deliverable
production ML models
Required skills
Yield diagnostics, failure analysis, yield modeling, statistical analysis, data mining, root-cause investigation, process-yield correlation, silicon bring-up, cross-functional yield investigations, yield forecasting, manufacturability analysis, advanced analytics, automation, AI/ML for yield
Preferred skills
Design-for-Yield (DFY) methodologies, advanced packaging/3DIC/chiplet knowledge, PCM/inline defect inspection, machine learning/AI for manufacturing optimization
Technologies
JMP, Yield Explorer, Python, SQL, Excel, Power BI, 2nm, A14, lithography, etch, deposition, CMP, interconnect, DFT, scan diagnosis
Responsibilities
Perform process and yield diagnostics across wafer fabrication, sort, test, and system validation; Lead test-chip characterization and yield learning; Drive systematic failure debug and root-cause investigations; Correlate process, product, design, and test data to identify yield loss mechanisms; Partner with Foundry and Process Integration for technology learning; Support NPI through yield risk assessments and manufacturing readiness; Develop and maintain yield models; Generate yield forecasts; Monitor yield performance and develop dashboards; Work cross-functionally to improve robustness and manufacturability; Provide early yield and manufacturability insights during product definition.
Seniority
Principal, hands-on IC with strategy & mentorship
