BEOL Process Integration Engineer, up to Sr. Staff
Core
Lead BEOL process integration strategy, technology development, and manufacturing enablement for advanced semiconductor nodes (2nm and beyond) in partnership with foundries.
Role type
Senior IC process integration engineer (BEOL)
Builds
Advanced interconnect technologies, 2.5D/3DIC packaging, and heterogeneous integration solutions for SoCs
Domain
Semiconductor manufacturing, advanced packaging, and heterogeneous integration
Required skills
BEOL process integration, interconnect RC optimization, yield and reliability analysis, root cause analysis, process control strategies, foundry interface management, PDK development, statistical process control (SPC/DOE), failure analysis techniques, heterogeneous integration processes
Preferred skills
Sub-5nm node experience, fabless semiconductor background, deep knowledge of Cu/Ru metallization and low-k dielectrics, electrical characterization, silicon debug, hybrid bonding and TSV expertise
Technologies
TSMC, Samsung, Cu/Ru metallization, low-k dielectrics, dual-damascene, lithography, etch, CMP, CVD/ALD, TEM, SEM, EDX, FIB, JMP
Responsibilities
Lead BEOL process integration strategy and technology development for advanced nodes; Serve as primary technical interface for BEOL process definition and qualification; Drive pathfinding and qualification of advanced packaging technologies; Translate product PPAC requirements into robust process specifications; Optimize interconnect RC performance; Investigate yield, reliability, and parametric issues; Define process control and monitoring strategies; Partner with foundries on design rules and PDKs; Lead technology qualification and HVM readiness activities
Seniority
Senior, hands-on IC
