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FY27 Intern - MSIP Design Methodology Engineering Internship - Canada (16 months)

Toronto, Ontario, CanadaInternship2026-09-17 → 2026-11-09

Core

Building optimized tools and AI/ML solutions to enhance back-end design flow, PPA optimization, and design efficiency for semiconductor products.

Role type

Intern, Design Methodology Engineering

Builds

Optimized design flow tools and AI/ML solutions for execution teams

Domain

Semiconductor / Hardware Design

Deliverable

production ML models

Required skills

Back-end design flow, Flow scripting, AI/ML development, LLM application, Physical synthesis, Static timing verification, Physical verification (DRC/LVS/ERC), EM/IR analysis

Preferred skills

IC design tools (synthesis, simulation, STA), Scripting (TCL/Python/Perl/C++), Linux/Unix environment, ASIC/IC design flow knowledge

Technologies

LLM, EDA tools, Verilog, Python, C/C++, TCL, Perl

Responsibilities

Gain hands-on experience with the complete back-end design flow; Assist in flow scripting and benchmarking; Develop AI/ML solutions to enhance design efficiency; Leverage LLM and EDA tools for PPA optimization; Support physical synthesis with power/area trade-offs; Assist with static timing verification and closure; Conduct physical verification (DRC, LVS, ERC); Perform EM/IR analysis.

Seniority

Intern