Cloud Hardware Design Engineer, up to Staff (Neihu)
Core
Design and develop motherboards, add-in cards, and modules for Qualcomm AI System on Chips (SoC) and System in Package (SIP) for next-generation liquid-cooled data centers.
Role type
Senior IC hardware design engineer (rack-level and board-level)
Builds
Rack-level AI inference solutions, high-performance PCIe cards, and server networking switches
Domain
Semiconductor hardware engineering, data center infrastructure, high-speed interfaces
Deliverable
production ML models
Required skills
PCIe Gen5/6 design, high-speed serial I/O (6–10+ Gbps), signal integrity analysis, thermal management, PCB layout (8–20+ layers), power delivery design, component qualification, ODM collaboration
Preferred skills
Rack-level system integration, BMC integration, firmware architecture knowledge, regulatory compliance testing
Technologies
Cadence Allegro, Mentor Expedition, SPICE, JTAG, PCIe, LPDDR4x/5x, DDR4/5, 200/400/800 GbE, x86/ARM
Responsibilities
Develop schematics, PCB layouts, and test plans for AI cards; collaborate with ODMs on rack-level integration; resolve architecture and design issues across system and card levels; provide technical oversight of manufacturing processes; coordinate technical training for ODMs.
Seniority
Senior, hands-on IC
