CareerPlan

Intern – DRAM Technology Physical Design and Block-Level PPA Optimization

Boise, Idaho, United States of AmericaInternship2026-09-21 → 2026-10-23

Core

Intern role optimizing power, performance, and area (PPA) for advanced memory products at the standard cell and logic block level.

Role type

Intern, physical design and PPA optimization

Builds

Standard cell logic blocks and optimized memory designs

Domain

Semiconductor / Memory / Physical Design

Deliverable

production ML models

Required skills

VLSI design concepts, ASIC physical design flow, scripting (Python/Perl/TCL), static timing analysis (STA), physical verification (DRC/LVS/IR-drop), Generative AI/AI automation

Preferred skills

Place-and-route tools (Synopsys ICC2, Cadence Innovus), timing verification tools (PrimeTime, Tempus), design constraints (SDC), LEF/DEF formats, low-power design (UPF/CPF), AI/LLM application

Technologies

Synopsys ICC2, Cadence Innovus, PrimeTime, Tempus, Python, Perl, TCL, UPF, CPF, SDC

Responsibilities

Implement standard cell logic blocks using physical design tools (floorplanning, placement, CTS, routing), analyze and benchmark PPA across libraries, perform static timing analysis and support timing closure, execute physical verification checks (DRC, LVS, IR-drop), leverage AI tools to automate data collection and workflow optimization

Seniority

Intern