Engineer – 3D NAND Process Integration
Core
Design, develop, integrate, and implement process solutions to improve next-generation 3D NAND product yield and quality with competitive cost and performance.
Role type
Senior IC semiconductor process integration engineer
Builds
Next-generation 3D NAND memory and storage products
Domain
Semiconductor manufacturing / Non-volatile memory
Deliverable
production ML models
Required skills
3D NAND process flow knowledge, structural & electrical fail mechanism analysis, cross-functional team leadership, data analysis, process integration optimization, technology transfer, AI tool integration
Preferred skills
JMP/Tableau proficiency, R&D product life cycle experience, alpha/derivative part type development
Technologies
JMP, Tableau
Responsibilities
Identify and quantify key module deficiencies and technology gaps; Develop or redefine CSPEC criteria for optimal product performance; Coordinate activities at the manufacturing site to secure funding for experiments and conversions; Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types; Take on a leadership role at quarterly yield summits and monthly program reviews; Assist in the transfer of new technology from R&D to manufacturing.
Seniority
Mid-level, hands-on IC