Senior Engineer, HIG HBM Media Health
Core
Lead high-volume manufacturing (HVM) test coverage, yield improvement, and product validation for Next Generation HBM (High Bandwidth Memory) architectures.
Role type
Senior IC semiconductor engineer (HBM manufacturing & validation)
Builds
High-volume manufacturing test programs and next-generation HBM products
Domain
Semiconductor / Memory / HBM
Required skills
HBM design architecture knowledge, high-volume manufacturing (HVM) test coverage optimization, circuit analysis and simulation (Verilog/CAD), yield improvement and cost reduction, root cause analysis for device qualification and RMA, process conversion recommendation, technical leadership and mentorship, project management, risk analysis and prioritization
Preferred skills
Python programming, logic gate and transistor operation knowledge, DRAM operation familiarity, semiconductor process knowledge, AI tool usage (e.g., Claude code)
Technologies
Verilog, CAD tools, Python, AI tools
Responsibilities
Optimize test coverage for current and future HBM design architectures and process nodes; Develop, validate, characterize, and qualify next-generation HBM products; Provide support for design verification and in-depth circuit analysis using CAD tools and Verilog simulations; Improve manufacturing test yields, reduce test time, and resolve yield-related issues; Identify and resolve issues related to device qualification and return material authorization (RMA); Recommend process conversions to fab teams to reduce cost and increase yields; Mentor team members and develop project management skills; Make final decisions on risk analysis and project prioritization; Collaborate with cross-functional teams (Fab, Design, System, Test, Quality) for end-product delivery
Seniority
Senior, hands-on IC with leadership responsibilities