Member of Technical Staff (MTS) – 3D NAND Process Integration
Core
Drive 3D NAND integration and technology roadmap, leading pathfinding and advanced architecture enablement in a cutting-edge R&D environment.
Role type
Senior IC semiconductor process integration engineer (3D NAND)
Builds
Next-generation memory technologies and manufacturable solutions
Domain
Semiconductor manufacturing / Memory storage / 3D NAND
Deliverable
production ML models
Required skills
Semiconductor device physics, Process integration, Experiment design, Data analysis, Cross-functional collaboration, AI-assisted problem solving
Preferred skills
Memory (NAND/DRAM) experience, Emerging/embedded memory technologies, Advanced data analytics, AI/ML techniques
Technologies
AI-enabled data analytics tools, Model-driven methodologies
Responsibilities
Drive 3D NAND integration and technology roadmap, Lead end-to-end development including learning vehicles and characterization, Solve complex integration challenges using data-driven approaches, Define and optimize module/process architecture, Collaborate across Device, Probe, Test, Design, and Operations teams, Drive technical innovation through process improvements and patents
Seniority
Senior, hands-on IC