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Director, HBM RTL Design and Integration

Richardson, Texas, United States of America💼 Full-time💰 $177,000–$177,000🗓 2026-06-23 → 2026-09-25

Core

Lead a team in the design, integration, and delivery of next-generation HBM SoC logic die, focusing on RTL development and IP integration for AI/ML and high-performance computing systems.

Role type

Director, HBM RTL Design and Integration

Builds

Next-generation HBM SoC logic die

Domain

Semiconductor / Memory / HBM / AI/ML

Deliverable

production ML models

Required skills

SoC RTL design, SoC integration, IP integration, EDA tools, scripting languages (SystemVerilog, Python, TCL), DRAM/HBM systems knowledge

Preferred skills

Tape-out leadership, cross-functional SoC program management, global engineering team management

Technologies

SystemVerilog, Python, TCL, TSMC processes

Responsibilities

Lead SoC RTL design and integration including subsystem partitioning and IP integration; Drive translation of architectural specs into robust RTL implementations; Oversee SoC integration aspects like clocking, reset, and power intent; Establish design methodologies to improve quality and efficiency; Partner with Architecture, Verification, and Physical Design teams; Build and scale a high-performing RTL design team

Seniority

Director, technical leadership & team management

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