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Principal Customer Integration Engineer, Product & Process Engineering (HBM)

Boise, Idaho, United States of America💼 Full-time🗓 2026-05-29 → 2026-09-25

Core

Enable successful integration of advanced HBM (High Bandwidth Memory) products into customer systems through hands-on technical problem-solving across product development, system architecture, and manufacturing processes.

Role type

Principal Customer Integration Engineer (HBM)

Builds

Advanced HBM memory and storage solutions

Domain

Semiconductor / Memory and Storage

Deliverable

production ML models | product features | infrastructure

Required skills

Product development, Systems build, Front-end/back-end process, Package Failure Analysis (PFA), Qualification, Test, System architecture, Technical problem-solving

Preferred skills

Cross-training in multiple subject areas, HBM architecture knowledge, Packaging technologies expertise, Analytical abilities, Adaptability to new technical domains

Technologies

HBM architecture, Packaging technologies

Responsibilities

Apply deep technical knowledge across product engineering, system engineering, build, and test domains; Support integration of customer requirements into internal design and manufacturing processes; Participate in technical reviews, debug sessions, and failure analysis activities; Work with internal teams to resolve technical challenges; Assist in yield improvement and qualification efforts tied to customer programs.

Seniority

Principal, hands-on IC

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