MSH PDE PI MANAGER
Core
Lead a team of Process Integration engineers to execute High Bandwidth Memory (HBM) New Product Introduction (NPI) from early development through High Volume Manufacturing (HVM), ensuring yield ramp and risk mitigation.
Role type
Senior IC Process Integration Manager (HBM NPI)
Builds
HBM memory products for data centers and AI applications
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | client delivery | infrastructure | physical/clinical work
Required skills
Process Integration (PI) leadership, NPI execution, team management, resource planning, cross-functional stakeholder engagement, root cause analysis, yield improvement, risk mitigation
Preferred skills
People management experience, advanced packaging expertise, HBM/3D-stacked technology background, yield stabilization track record, data analytics familiarity
Technologies
HBM, 3D-stacked technologies, yield dashboards, automation tools
Responsibilities
Lead, coach, and develop a team of PI engineers; Own PI execution for HBM NPI programs ensuring milestone delivery; Provide technical leadership for process integration strategies and yield improvement; Act as primary PI interface to cross-functional teams (YE, MRDA, Process Engineering, etc.)
Seniority
Senior, hands-on IC with people leadership
