Staff Equipment Development Engineer - Advanced Packaging
Core
Develop and optimize next-generation, first-of-a-kind wafer and die equipment for semiconductor manufacturing, taking ideas from conception through implementation.
Role type
Staff Equipment Development Engineer (Advanced Packaging)
Builds
Next-generation semiconductor packaging equipment and processes
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | infrastructure
Required skills
Semiconductor process/equipment engineering, Failure analysis (FMEA, 8D, FDC), Design of Experiment (DOE), Statistical Process Control (SPC), Root cause analysis, Wafer/assembly tool operation, Overlay systems
Preferred skills
Robotics, Machine logic language, Hardware design, Wafer/die bonding, Plating, Warpage control
Technologies
FMEA, 8D, FDC, DOE, SPC
Responsibilities
Develop strategies to improve equipment maturity for FOAK hardware; Develop hardware roadmaps for post probe wafer and die processing; Optimize equipment to reduce cost and increase availability; Collaborate with process development teams; Conduct root cause and failure mode analysis; Perform fundamental research for next-generation equipment; Support equipment transfer to production facilities
Seniority
Staff, hands-on IC with strategic roadmap influence
