Technician - F10 Failure Analysis
Core
Perform physical failure analysis on semiconductor wafers using advanced microscopy and de-processing techniques to identify defects and root causes impacting production quality.
Role type
Technician - Semiconductor Failure Analysis
Builds
Production quality assurance for DRAM, NAND, and NOR memory and storage products
Domain
Semiconductor manufacturing / Failure Analysis
Deliverable
physical/clinical work
Required skills
Scanning Electron Microscopy (SEM) inspection, Transmission Electron Microscopy (TEM) sample preparation, Focus Ion Beam (FIB) handling, sample de-processing techniques, physical fault isolation, defect identification, root cause analysis, chemical handling safety, documentation of analytical findings
Preferred skills
Real-Time Defect Analysis (RDA) experience, AI-assisted tool integration, continuous improvement initiatives
Technologies
SEM, TEM, FIB, Failure Analysis equipment, AI-enabled tools
Responsibilities
Perform cross-section analysis and SEM inspection to monitor process health, Handle TEM sample preparation using FIB, Identify defects and failure mechanisms through physical analysis, Complete physical fault isolation techniques, Collaborate with engineering teams for tool performance feedback, Support analysis of wafers with functional failures, Preserve comprehensive documentation of analytical findings, Integrate AI-assisted tools into daily work, Contribute to a culture of continuous improvement
Seniority
Technician, hands-on operational role
