NTI Physical Failure Analysis Technician
Core
Physical Failure Analysis (PFA) technician identifying root causes of yield issues in next-generation semiconductor memory products through hands-on analysis and process integration.
Role type
Physical Failure Analysis Technician (Semiconductor Manufacturing)
Builds
Production-ready memory processes and nodes for manufacturing
Domain
Semiconductor memory (NAND/DRAM) fabrication and yield enhancement
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Wet and dry delayering techniques, Focused Ion Beam (FIB) operation, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), STEM lamella creation, semiconductor device physics knowledge, root cause analysis, process integration
Preferred skills
AI-assisted tool integration, continuous improvement mindset, creative problem solving, data interpretation
Technologies
Dual beam FIB, SEM, TEM, STEM, acid hood, polish wheel, bench testers, emission and laser techniques
Responsibilities
Delayer failing devices using wet/dry techniques, operate FIB/SEM/TEM for cross-section and top-down analysis, generate slice/view images for process feedback, identify and communicate new failure mechanisms, test new processes to improve productivity, maintain PFA tool uptime
Seniority
Individual Contributor, hands-on technical execution
