Sr Assoc Eng Failure Analysis
Core
Conducting hands-on physical failure analysis on semiconductor devices to identify root causes and drive process improvements.
Role type
Senior IC failure analysis engineer (semiconductor manufacturing)
Builds
Semiconductor device failure analysis reports and corrective actions
Domain
Semiconductor manufacturing / Failure Analysis
Required skills
Die polishing, deprocessing, FIB operation, XSEM operation, EDX analysis, sample preparation, root cause analysis, report writing, equipment maintenance
Preferred skills
Lab environment experience, training certification for technicians, cross-functional collaboration
Technologies
Focused Ion Beam (FIB), Scanning Electron Microscopy (XSEM), EDX, SELA wafer cleaving, chemical decoration
Responsibilities
Perform die polishing, deprocessing, and sample preparation; Operate FIB, XSEM, and EDX tools; Write detailed FA reports; Review and approve technician work; Conduct training for technicians; Perform preventive maintenance on FA equipment; Analyze defective products to identify trends
Seniority
Senior, hands-on IC