ENGINEER, MTB PQA LAB
Core
Conduct failure analysis, root cause investigations, and advanced package characterization for semiconductor devices and packages to support product development and yield improvement.
Role type
Failure Analysis Engineer (Semiconductor)
Builds
Semiconductor memory and storage products (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing and failure analysis
Required skills
Fault Isolation, Voltage Contrast, Delayer/Deprocessing, Cross-section Analysis, Die-level Failure Analysis, Root Cause Analysis, FIB, SEM/EDS, 3D X-ray/CT, CSAM, Optical Microscopy, Hot Spot Analysis, Emission Microscopy, OBIRCH, PHEMOS, Sample Preparation
Preferred skills
HBM Failure Analysis, Advanced Packaging Technologies, TSV Analysis, Micro-bump Inspection, Hybrid Bonding Characterization, Die Crack Analysis, Delamination Investigation, Thermal Failure Analysis, Material Characterization, Python, JMP, Power BI, SQL, Machine Learning, AI-assisted engineering tools
Technologies
FIB, SEM, EDS, 3D X-ray, CT, CSAM, EMMI, OBIRCH, PHEMOS
Responsibilities
Perform electrical and physical failure analysis of semiconductor devices and packages, Conduct root cause investigations and provide technical recommendations, Develop and execute analytical plans to support engineering requests, Interpret analytical results and communicate findings effectively, Collaborate with Process, Product, Quality, Reliability, and Manufacturing teams, Generate technical reports and present findings to stakeholders, Support urgent customer and production-related failure analysis activities
Seniority
Mid-level, hands-on IC