Silicon Reverse Engineer
Core
Teardown and characterization of leading-edge AI and datacenter hardware (GPUs, CPUs, accelerators, memory, networking silicon) from rack to transistor to produce competitive insights and design analysis.
Role type
Senior IC silicon reverse engineer / teardown specialist
Builds
Defensible technical conclusions on process, packaging, design intent, architecture, and cost for industry clients
Domain
Semiconductor hardware, AI infrastructure, advanced packaging, microarchitecture
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery
Required skills
Process integration (FEOL/BEOL), advanced packaging (2.5D/3D, hybrid bonding), IC layout and physical design, CPU/GPU/accelerator architecture, memory technologies (HBM, DRAM, NAND), analog/mixed-signal (SerDes, PLLs, PHYs), failure analysis (FIB, nanoprobing), electron microscopy (SEM, TEM/STEM), materials characterization, board/system power delivery, silicon bring-up and debug, cost modeling
Preferred skills
Hands-on aptitude for sample preparation and analytical instruments, technical writing under expert scrutiny, industry networking and conference presence
Technologies
X-ray, precision cross-sectioning, delayering, FIB, SEM, TEM, EDS, EELS, SIMS, XPS
Responsibilities
Tear down and characterize hardware end-to-end using imaging and analytical tools; convert physical evidence into conclusions on design and process intent; publish comprehensive analysis reports; set analytical plans and operate toolchains; track industry trends via conferences and patents; shape lab workflows and equipment strategy
Seniority
Senior, hands-on IC with industry influence