Photonics Design Engineer – PIC Layout & Tape-Out (m/w/d)
Core
Lead the entire PIC tape-out process including circuit coordination, layout integration, DRC release, and documentation for photonic integrated circuits.
Role type
Senior IC photonics design engineer (PIC layout & tape-out)
Builds
Photonic integrated circuits (PICs) and photonic components
Domain
Photonics / Semiconductor manufacturing
Required skills
PIC layout design, tape-out coordination, DRC verification, PDK development, Python scripting, photonic simulation (FDTD, Eigenmode Expansion), circuit-level simulation, foundry process knowledge
Preferred skills
Junior engineer mentorship, design workflow automation, component development (via careerplan.io/jobs/2763708-photonics-design-engineer-pic-layout-tape-out-mwd-at-pmx-gmbh)
Technologies
Python, FDTD, Eigenmode Expansion, PIC layout tools
Responsibilities
Coordinate multiple parallel tape-out projects, interface with foundries and external manufacturing partners, resolve design-rule conflicts, contribute to photonic technology roadmap, develop new components and optimization strategies
Seniority
Senior, hands-on IC